With the soft soldering plays the layer thickness an important role. Good results are obtained between 2 and 5 Ám.




With the hard soldering is it recommendable to work under inert gas and considering the melting point.

Note: The solderability of aluminum materials can be made possible only with an en coat -  approx. 5 Ám.  

Electroless nickel - solderability of deposited layers


The determinations of the solderability are testing methods for the measurement of the wetting behavior on soldering conditions - DIN 32506. Important for the general soldering behavior are apart from temperature and time an active chemical nickel surface, the plumb and the suitable fluxing agent.

Different views exist to the solderability of en coats. In all rule applies however the principle , if soldering conditions are adapted to the respective coat.

Among other things exist practical experiences over a good soldering behavior :

  • if the Ni-P-layer not to long stored temporarily

  • on longer stored surfaces to remove the oxide film

  • P-poorer layers are better to solder than P-rich

  • also thinner layers are better to solder than thicker

  • dull layers are rather suitable than shining


electroless nickel plus gold


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